Philips has
has announced a new 802.11b low-power WiFi LAN and Bluetooth semiconductor "system-in-a-package" (SiP) solution specifically designed to operate at the same time in small form-factor systems such as smart phones, PDAs and other portable devices. "This means a consumer can use a mobile phone equipped with a Bluetooth wireless headset to make a call while using the same phone to simultaneously check information on the Internet via a WLAN network - without experiencing interference", according to Philips.
Philips' new chips will be sampling in July 2004 and will be available in production quantities in Q4 2004.