Quote:
Originally Posted by JSWolf
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Thank you for the video, but unfortunately, the provided footage demonstrates standard SMD soldering to existing contact pads.
In my specific case, the PCB land patterns have suffered approximately 50% delamination or destruction. Consequently, a direct pad-to-component bond is not viable.
I will likely need to perform a
trace bypass or
point-to-point jumper wire repair, rerouting the electrical path from its original via or component source directly to the external port interface.
Here is the example how previous owner did the same with battery.