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geekmaster · 05-19-2016, 08:28 PM

I can donate a spare "cheap-ass" sound dongle (proven working) and a USB OTG cable (if I can find one -- I gave most of them to friends). And we can save the one-month shipping from China. I no longer have "spare money"...

The postage to you would cost more than the $1.48 in parts.

BTW, these sound dongles snap apart and the thick parts are USB jack, the headphone and microphone jacks, and a couple of thru-hole capacitors. It could have the thick parts removed or reloacted, and be comfotably glued inside a kindle, I think. Perhaps we can wire it to the unused 3G USB instead of the "usbnet" USB? But that would require a bit of kernel module reconfiguration -- prehaps not yet worth the effort, and prone to firmware update breakage, perhaps.

My original goal for these USB sound dongles was for K4 sound support. Now that I am studying Kernel Module development AND toolchain building, perhaps I can actually do that soon.

EDIT: Actually, I think I will remove that thick USB jack from my sound dongle, snip off the thick end of the OTG cable, and solder the two together. I could also remove the audio jacks and solder in a headset. That would convert it into a USB headset, and if I move those capacitors to the side of the board (or replace them with equivalent surface-mount capacitors), it would be much smaller and thinner.

05-19-2016, 08:28 PM	#2
geekmaster Carpe diem, c'est la vie. Posts: 6,433 Karma: 10773670 Join Date: Nov 2011 Location: Multiverse 6627A Device: K1 to PW3	I can donate a spare "cheap-ass" sound dongle (proven working) and a USB OTG cable (if I can find one -- I gave most of them to friends). And we can save the one-month shipping from China. I no longer have "spare money"... The postage to you would cost more than the $1.48 in parts. BTW, these sound dongles snap apart and the thick parts are USB jack, the headphone and microphone jacks, and a couple of thru-hole capacitors. It could have the thick parts removed or reloacted, and be comfotably glued inside a kindle, I think. Perhaps we can wire it to the unused 3G USB instead of the "usbnet" USB? But that would require a bit of kernel module reconfiguration -- prehaps not yet worth the effort, and prone to firmware update breakage, perhaps. My original goal for these USB sound dongles was for K4 sound support. Now that I am studying Kernel Module development AND toolchain building, perhaps I can actually do that soon. EDIT: Actually, I think I will remove that thick USB jack from my sound dongle, snip off the thick end of the OTG cable, and solder the two together. I could also remove the audio jacks and solder in a headset. That would convert it into a USB headset, and if I move those capacitors to the side of the board (or replace them with equivalent surface-mount capacitors), it would be much smaller and thinner. Last edited by geekmaster; 05-19-2016 at 08:48 PM.