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Old 10-20-2012, 09:08 AM   #2
knc1
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Posts: 17,212
Karma: 18210809
Join Date: Feb 2012
Location: Central Texas
Device: No K1, PW2, KV, KOA
Developer's Corner Master Index ->
K4 ->
Serial port ->

Also:
https://www.mobileread.com/forums/sho...7&postcount=27

Also:
In the index system, see if there is a "teardown" listed for the K4

Things such as:
http://blogkindle.com/2011/09/kindle...sembly-part-i/

Although a web-search tool might find ones with more detail (like gently heating the center of the back with a heat gun (hair dryer?) to make the glue release easier).

If you can avoid it, it would be better that you did not try to solder to the pads on the circuit board.
Even geekmaster (with more decades of experience than is polite to mention) had trouble with the pads lifting.

Last edited by knc1; 10-20-2012 at 09:16 AM.
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