Quote:
Originally Posted by Prospect
I would guess that the HW changes are in exterior like buttons.
|
Possible but doubtful. More likely nothing in the exterior case size or tooling/buttons has been changed. Instead existing parts will have been updated... like someone said above. Possibilities...
More NAND memory build in
Possible support for SDHC cards
Faster processor
New eInk controller (Epson thing?)
Better material for case and/or better finish
BOb